Tag: Advanced packaging (semiconductors)

ManufacturingSemiconductors

Nvidia Blackwell Enters Volume Production with First US-Made Wafer from TSMC Arizona Facility

The inaugural US-manufactured Nvidia Blackwell wafer has been produced at TSMC’s Phoenix facility, marking a key milestone in domestic semiconductor output. Despite this achievement, analysts indicate the chips must still be sent to Taiwan for advanced packaging before completion.

US Semiconductor Milestone Achieved with Blackwell Wafer

The first Nvidia Blackwell wafer manufactured in the United States has been completed at TSMC‘s fabrication plant in Phoenix, Arizona, according to reports from the chipmaker. This production signals that the Blackwell series has entered volume manufacturing, a critical step in meeting global demand for advanced computing hardware.

by Nathan Cole
International Business and TradeSemiconductors

ASML Addresses 2026 Growth Concerns Amid China Sales Warning

Dutch semiconductor giant ASML is working to calm investor fears about 2026 growth while simultaneously warning of significant sales declines in China. The company’s guidance comes amid ongoing geopolitical tensions and export restrictions affecting the global chip industry.

ASML Holding, the Dutch semiconductor equipment manufacturer that recently became Europe’s most valuable listed company, is navigating a complex landscape of growth assurances and market warnings. The company has moved to reassure investors that 2026 total net sales won’t fall below 2025 levels, while simultaneously cautioning about significant sales declines in China for the coming year.

ASML’s Strategic Positioning Amid Market Uncertainty

by Nathan Cole
AI ImpactComputer Hardware

OpenAI Broadcom Partnership: $350B AI Hardware Deal Targets 10GW Accelerators

OpenAI announced a massive partnership with semiconductor giant Broadcom for 10 gigawatts of custom AI accelerator hardware. The deal, estimated at $350-500 billion, represents OpenAI’s latest infrastructure investment to support next-generation AI models. Deployment begins in 2026 across OpenAI and partner data centers.

OpenAI has formed a strategic partnership with semiconductor company Broadcom to develop and deploy 10 gigawatts worth of custom AI accelerator hardware, marking one of the largest AI infrastructure deals in history. According to recent analysis by the Financial Times, the collaboration could cost OpenAI between $350 billion and $500 billion, though official terms remain undisclosed. The custom AI accelerator racks will begin deployment in 2026 and continue through 2029 across OpenAI’s data centers and partner facilities.

Strategic AI Hardware Collaboration Details

by Nathan Cole
Assistive TechnologyInnovation

IEEE Innovation Summit Advances Strategic Technology Initiatives

The IEEE Innovation Summit in Scotland established new frameworks for funding strategic technology initiatives. The event focused on clean technology solutions and AI-driven engineering projects. Over 80 proposals were evaluated for implementation through IEEE’s New Initiatives Committee.

IEEE innovation summit participants have developed new frameworks for funding strategic technology initiatives, with particular focus on clean energy solutions and artificial intelligence applications. The recent gatherings in Scotland brought together engineering leaders to address how IEEE strategic initiatives can accelerate technological development while reducing environmental impact. According to recent analysis, these efforts align with global trends in sustainable technology investment.

Clean Technology Solutions Take Center Stage

by Nathan Cole